JPH0451147U - - Google Patents
Info
- Publication number
- JPH0451147U JPH0451147U JP1990092062U JP9206290U JPH0451147U JP H0451147 U JPH0451147 U JP H0451147U JP 1990092062 U JP1990092062 U JP 1990092062U JP 9206290 U JP9206290 U JP 9206290U JP H0451147 U JPH0451147 U JP H0451147U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- package
- metal base
- attached
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990092062U JP2515660Y2 (ja) | 1990-08-31 | 1990-08-31 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990092062U JP2515660Y2 (ja) | 1990-08-31 | 1990-08-31 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0451147U true JPH0451147U (en]) | 1992-04-30 |
| JP2515660Y2 JP2515660Y2 (ja) | 1996-10-30 |
Family
ID=31828241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990092062U Expired - Lifetime JP2515660Y2 (ja) | 1990-08-31 | 1990-08-31 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515660Y2 (en]) |
-
1990
- 1990-08-31 JP JP1990092062U patent/JP2515660Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515660Y2 (ja) | 1996-10-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |